Blue Laser Welding Machine-正鉑股份有限公司-雷射打標機-雕刻機-切割焊接機-大氣電漿機

Supports Reclaimed Wafer Processing:
The equipment is suitable for wafer grinding and cleaning processes, enabling the reuse of wafers that do not meet IC manufacturing standards or are used as dummy/control wafers. This helps reduce testing costs and improve resource utilization.

Reduces Environmental Impact:
Wastewater generated during the grinding process—containing silicon particles and chemical substances—can be managed with wastewater treatment modules, minimizing potential environmental harm.

Meets High-Demand Application Fields:
Reclaimed wafers are ideal for process development in industries such as solar energy and silicon-based semiconductors, fulfilling testing and monitoring requirements while enhancing overall process efficiency.

Built-in Laser Micromachining Module:
Equipped with high-precision laser marking capabilities, the equipment can directly mark serial numbers, QR codes, and other production traceability data on wafers, ensuring accurate and reliable identification.

Complies with Semiconductor Process Standards:
The laser marking technology offers high durability and resistance to harsh processing conditions, making it especially suitable for high-standard environments such as packaging and testing stages.